Teardown & Benchmarking Capabilities

Teardown and reverse engineering capabilities are fascinating fields that involve taking apart devices to understand their internal structure and functionality. Here are some key aspects:Teardown

• Disassembly: Taking apart a device to examine its components and how they are assembled.
• Analysis: Identifying and cataloging each component, such as chips, circuits, and materials used.
• Cost Estimation: Providing an in-depth cost estimate of the bill of materials (BOM).

Reverse Engineering

• Decapsulation: Removing the outer layers of integrated circuits (ICs) to reveal their internal structure.
• Microscopy: Using advanced techniques like Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) to analyze each layer of the chip.
• Circuit Extraction: Extracting and analyzing the circuitry to understand how the device operates.

VTS Team Capabilities & Skills

Teardown Lab Equipment’s & Tools

Instruments & Lab Equipment’s

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